Shanghai, 23rd September: Next month, Fiera Milano will launch a new event serving the e-commerce packaging sector in China. E-PACK TECH by Ipack Ima will be held from 23rd to 26th October 2019 at Shanghai New International Expo Centre (SNIEC).

Organised by Hannover Milano Fairs Shanghai, a Chinese joint venture between Deutsche Messe and Fiera Milano, the new show will feature packaging technologies and solutions designed for the e-commerce market.