New “e-commerce packaging” show to come to Shanghai in 2019

Shanghai, 7th November: Tapping into the rapid growth of e-commerce services in China, a new niche event focused on - e-commerce packaging will be launched next year. The new show, Epack-Tech Asia, will be organised in 2019 and it will focus on food and non-food processing and packaging technologies.

The new show will be organised by Fiera Milano through Hannover Milano Fairs Shanghai, its Chinese joint venture with Deutsche Messe AG and it will be held along side CeMAT Asia in October 2019.